China Electron Beam Evaporation Thin Film Equipment Manufacturers Suppliers Factory

Product Overview

This Electron Beam Evaporation Thin Film Equipment is engineered for high-precision physical vapor deposition (PVD). Utilizing a focused high-energy electron beam to bombard source materials, the system achieves high evaporation rates for high-melting-point metals, oxides, and dielectric materials.

Built on a modular vacuum architecture, the system accommodates multi-pocket electron guns, customizable substrate fixtures, and advanced in-situ monitoring. It serves R&D laboratories and high-throughput production lines requiring strict control over film stoichiometry, adhesion, and optical performance.

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Technical Specifications

Parameter	Specification Range	Notes / Standard Configuration
Ultimate Base Pressure	< 5.0 × 10^-6 Pa	Achieved via cryogenic or turbo-molecular pumping groups
Chamber Dimensions	Customized (500 mm to 1200 mm internal diameter)	304L / 316L stainless steel, electro-polished
E-Gun Power Rating	6 kW to 15 kW (Multi-pocket sweep generators)	Programmable beam deflection and multi-crucible indexing
Deposition Rate	0.1 nm/s to 10 nm/s	Real-time closed-loop control via quartz crystal monitor
Film Thickness Uniformity	< ±1% to ±2% across standard substrates	Planetary or dome substrate fixture with variable speed rotation
Substrate Temperature	Ambient to 800°C	Integrated radiant heating with PID thermal feedback

Key Equipment Features

High-Stability Electron Gun:

Features magnetic deflection and multi-point focusing to prevent local overheating of source materials and eliminate spitting during reactive evaporation.

Modular Crucible Design:

Equipped with 4 to 6-pocket indexable hearths, allowing multi-layer depositions without breaking vacuum.

Advanced Vacuum Interlock:

PLC-controlled pneumatic valves, automated roughing/high-vacuum sequencing, and interlocks protect against cooling water failure and power anomalies.

Low-Contamination Chamber:

Internal shielding utilizes electro-polished stainless steel with removable liners for quick particulate reduction and maintenance turnaround.

Film Materials & Substrates

Compatible Evaporation Materials

Metals: Au, Ag, Al, Ti, Cr, Ni, Pt, Cu, Mo, W
Dielectrics & Oxides: SiO2, TiO2, Al2O3, Ta2O5, HfO2, ITO

Substrate Types

Silicon wafers (2 inch to 12 inch)
Optical glass, fused silica, and quartz substrates
Flexible polymer films (polyimide, PET via roll-to-roll modules)
Ceramic substrates (Al2O3, AlN)

Applications

High Vacuum Electron Beam Evaporation Equipment

Optical Coatings:

Anti-reflective (AR) coatings, narrow-band filters, and high-reflectivity mirrors for laser and photonics systems.

Electron Beam Thin Film Deposition System

Semiconductor Devices:

Ohmic contact formation, gate metallization, and lift-off processing for microelectronics.

Electron Beam Vacuum Evaporation Equipment

Optoelectronics:

Transparent conductive oxide (TCO) layers and thin films for OLED displays and photovoltaic cells.

Electron Beam Evaporation Thin Film System

Advanced R&D:

Exploratory thin-film magnetic layers, superconductive films, and multi-layer heterostructures.

Customization & System Configuration

Every thin-film system is configured to match specific process recipes and facility layouts. Available engineering adaptations include:

Pumping Stack Selection:

Turbo-molecular pumps (TMP), cryopumps, or oil-diffusion configurations tailored to base vacuum and throughput requirements.

Load-Lock Integration:

Manual load-lock or automated multi-chamber cluster systems to maintain ultra-high vacuum integrity and increase wafer throughput.

In-Situ Metrology:

Integration ports for spectroscopic ellipsometers, optical monitors, or residual gas analyzers (RGA).

Control Software:

Proprietary PLC/HMI interface with recipe storage, data logging, and SECS/GEM communication protocols for smart factory integration.

Manufacturing & Quality Control

01.

Vessel Fabrication:

All vacuum chambers undergo helium mass spectrometer leak testing with a rejection threshold of < 1 × 10^-9 Pa·m³/s.

02.

Weld Integrity:

TIG welding performed under inert gas shielding, followed by internal surface passivation and mechanical polishing to reduce outgassing.

03.

Factory Acceptance Testing (FAT):

72-hour continuous dry-run test measuring pumping curves, e-gun sweep precision, interlock response times, and thermal stability before crating.

04.

Compliance & Standards:

Manufactured under an ISO 9001 certified quality management system, with systems engineered to meet CE directives and relevant SEMI (S2/S8) safety and ergonomic guidelines.

Installation & Technical Support

On-Site Commissioning:

Factory-certified service engineers handle mechanical positioning, utility hookups (power, cooling water, compressed air), and initial vacuum bake-out.

Process Tuning:

Collaborative trial runs using customer-specified substrates to verify deposition rates, uniformity, and film adhesion.

Lifecycle Maintenance:

Guaranteed spare parts availability for high-wear components (filaments, crucibles, shields) and remote diagnostic support via encrypted industrial VPN connections.

FAQ

Q: What is the typical lead time for a standard system configuration?

A: Standard configurations ship within 16 to 20 weeks from drawing approval. Highly customized systems requiring special load-lock configurations or non-standard chamber geometry range from 24 to 30 weeks.

Q: How do you prevent material cross-contamination between different evaporants?

A: The system utilizes individual water-cooled hearth pockets separated by thermal and physical barriers, coupled with optimized electron beam sweeping patterns that eliminate material spattering.

Q: What are the facility utility requirements for a 10 kW system?

A: Requirements typically include 3-phase 380V/480V AC power, closed-loop chilled water supply (10–15°C, flow rate >30 L/min), and dry compressed air (0.6–0.8 MPa) for pneumatic valves.

We're well-known as one of the leading electron beam evaporation thin film equipment manufacturers and suppliers in China. If you're going to buy customized electron beam evaporation thin film equipment made in China, welcome to get pricelist from our factory. For price consultation, contact us.

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