High Vacuum Electron Beam Evaporation Equipment

The EBE-Series High Vacuum Electron Beam Evaporation System deposits high-purity thin films for optical, semiconductor, and metallurgical applications. By directing a magnetically focused electron beam onto source materials inside a vacuum chamber, the system achieves localized heating and rapid vaporization. This method prevents crucible contamination and processes refractory metals and high-purity dielectrics effectively.

The stainless steel chamber integrates cryopumps or turbomolecular pumps, reaching base pressures below 5 x 10^-5 Pa to minimize residual gas incorporation during film growth.

Direct E-Beam Heating: Bypasses resistive boat limits; melts high-melting-point materials including tungsten, platinum, and alumina.

Programmable Beam Sweep: Dual-axis electromagnetic coils distribute the beam across the evaporant surface, preventing cratering and ensuring uniform material consumption.

Multi-Pocket Indexing: Water-cooled copper crucibles enable sequential multi-layer deposition without breaking vacuum.

QCM Rate Monitoring: Dual quartz crystal sensors monitor deposition rate and film thickness, linking directly to the PLC/PID controller.

Safety Architecture: Hardware interlocks protect against cooling water failure, high chamber pressure, and door seal leakage.

Roughing Stage: Dual-stage rotary vane pump paired with a roots blower achieves fast roughing down to 10 Pa.

High Vacuum Stage: Turbo-molecular pump (1200 L/s to 2200 L/s) coupled with a closed-loop helium cryogenic pump, isolated by pneumatic gate valves.

Pressure Monitoring: Full-range Pirani/Cold Cathode gauges track chamber pressure from atmosphere to ultra-high vacuum.

Diagnostics: KF and CF flanged ports accommodate helium leak detectors.

Semiconductor Fabrication: Metal gate contacts, diffusion barrier layers, and ohmic contacts (Ti/Pt/Au, Cr/Au).

Optical Interference Filters: Multi-layer coatings for laser mirrors, bandpass filters, and anti-reflective lenses using alternating dielectric oxides.

Photovoltaic R&D: Thin-film layers for perovskite and CIGS solar cells.

Functional Coatings: Protective metallic oxide layers for aerospace and sensor components.

Chamber Geometry: Vertical or horizontal cylindrical chambers scaled for large flat panels or 3D parts.

Substrate Modification: DC/RF biasing for ion-assisted deposition (IAD) and substrate heaters rated up to 600 deg C.

Load-Lock Integration: Single- or dual-wafer load-lock chambers to reduce pump-down cycles during high-throughput runs.

Control Integration: Customized PLC/SCADA scripts supporting recipe automation, data logging, and SECS/GEM communication.

Helium Mass Spectrometer Leak Testing: Chambers tested to thresholds below 1 x 10^-9 Pa*m^3/s prior to factory acceptance.

Electrical Safety Verification: High-voltage insulation resistance, grounding continuity, and interlock tests executed per CE/IEC standards.

Dimensional Inspection: Coordinate measuring machine (CMM) verification of sealing surfaces and flange alignments.

Factory Acceptance Testing (FAT): 72-hour continuous dry run of vacuum pumps, motion assemblies, and power units with full data reports.

On-Site Commissioning: Engineers manage chamber leveling, utility hookups (water, power, gas, exhaust), and initial vacuum bake-out.

Process Calibration: Technical support establishes baseline deposition rates and film thickness calibration curves during site acceptance testing (SAT).

Spare Parts Dispatch: Critical wear parts-filaments, crucibles, QCM crystals, and vacuum seals-stocked locally.

Remote Diagnostics: Secure diagnostic modules enable real-time PLC log retrieval for rapid troubleshooting.