Cathodic Arc Thin Film Equipment

Cathodic Arc Thin Film Equipment

Details
Physical vapor deposition (PVD) system utilizing localized low-voltage, high-current electrical arcs to vaporize solid cathode targets into fully ionized plasma. The high ionization rate (40%-80%) drives dense atomic-level bonding and high compressive stress, enabling high-rate deposition of wear-resistant and decorative coatings on high-speed steel (HSS), carbide cutting tools, automotive components, and medical devices.
Category
Arc Evaporation Thin Film Equipment
 
Send Inquiry
Description
Technical Parameters

Physical vapor deposition (PVD) system utilizing localized low-voltage, high-current electrical arcs to vaporize solid cathode targets into fully ionized plasma. The high ionization rate (40%-80%) drives dense atomic-level bonding and high compressive stress, enabling high-rate deposition of wear-resistant and decorative coatings on high-speed steel (HSS), carbide cutting tools, automotive components, and medical devices.

 

Technical Specifications

 

Parameter

Specification Range / Details

Chamber Dimensions

Customized internal volume (Φ 800 × 1000 mm to Φ 1500 × 1600 mm, SUS304/SUS316L double-wall water-cooled)

Ultimate Pressure

≤ 5.0 × 10⁻⁴ Pa (turbomolecular and roots/rotary backing pump configuration)

Working Pressure

0.1 Pa ~ 2.0 Pa (Ar, N₂, C₂H₂, O₂)

Cathode Arc Sources

4 to 12 distributed circular/rectangular filtered or standard sources with independent magnetic steering

Substrate Bias

Pulsed DC bias (0 to -1000 V adjustable, 10–100 kHz)

Heating System

Radiative quartz heaters; maximum baking temperature 500°C (±5°C uniformity)

Control Architecture

Siemens PLC + Industrial PC (IPC); automated recipe execution and manual hardware override

Electrical Supply

3-phase, 380V/480V, 50Hz/60Hz (configured per regional standards)

 

Key Features


High Ionization Efficiency: Plasma ionization rate reaches 40%-80%, ensuring superior film-to-substrate adhesion.


Modular Cathodes: Quick-change target assembly minimizes maintenance downtime; compatible with planar and rotatable cylindrical cathodes.


Closed-Loop Gas Control: MKS mass flow controllers maintain precise reactive gas partial pressures for compound films (TiAlN, TiCN).


Multi-Axis Planetary Rotation: Customized rotation and revolution drives ensure thickness uniformity (±5%) across complex 3D geometries.


Dual-Mode Operation: Supports DC arc evaporation and pulsed bias sputtering integration for multi-layer architectures.

 

Vacuum System Configuration


Roughing Pumps: Roots and rotary vane pump combination for rapid pump-down from atmosphere to 10 Pa.


High Vacuum Pump: Magnetically levitated turbomolecular pump (1600–3200 L/s) ensuring hydrocarbon-free base pressure.


Valves & Gauging: Pneumatic high-vacuum gate valves with Pirani and cold cathode ionization interlocks to prevent oil backstreaming.


[Visual Guide for Web Producer]: Insert schematic or clear photo of the vacuum plumbing layout, highlighting turbomolecular pump and pneumatic gate valve positioning.

 

Evaporation Materials & Substrate Compatibility


Standard Cathode Targets (Purity ≥ 99.95%)
Transition Metals:
Ti, Cr, Zr, Al, TiAl (50/50, 33/67 atomic ratios), CrAl, W, Nb, Si.


Alloys & Compounds: Graphite (for DLC interlayers), stainless steel.


Substrate Compatibility & Pre-Treatment
Materials:
WC-Co cutting tools, hobbing cutters, broaches, stamping dies, injection molds, titanium alloys (Grade 5), and stainless steel.


Pre-Treatment: Ultrasonic solvent degreasing and in-situ ion bombardment cleaning (Ar⁺ plasma etching) inside the chamber prior to deposition.

 

Applications


Cutting & Forming Tools: TiN, TiAlN, and AlCrN coatings raising surface hardness to 3000–3500 HV, suppressing thermal cratering and abrasive wear.


Automotive Components: Friction-reducing coatings for piston rings, fuel injection pins, and gear components.


Medical Implants: Biocompatible TiN and ZrN hard coatings on orthopedic joint replacements and surgical screws.


Decorative Hardware: Color spectrum production (gold brass, rose gold, gunmetal black, titanium grey) via reactive gas tuning.

 

Customization Options


Chamber Geometry: Vertical loading (pit-mounted or floor-standing) or horizontal front-loading configurations.


Source Configuration: Filtered cathodic arc (FAC) magnetic duct sources to eliminate macroparticles for optical or precision electronics.


Automation: Robotic loading arms, AGV docking integration, and MES data logging protocols.

 

Quality Control & Factory Testing


Leak Detection: Helium mass spectrometer testing on all chambers and weld seams (≤ 1 × 10⁻⁹ Pa·m³/s).


Electrical Safety: High-voltage insulation resistance, grounding continuity, and PLC interlock functional verification.


Trial Run (FAT): 72-hour continuous dry-run test plus standard coating deposition test evaluated via Calo-test (thickness) and scratch tester (adhesion).


Documentation Package: Electrical schematics, P&ID diagrams, PLC source codes, material certificates, and FAT reports.

 

Installation & Technical Support


Site Preparation: Detailed layout drawings, cooling water metrics, and power distribution specifications provided 4 weeks prior to shipment.


Commissioning: On-site mechanical assembly, vacuum calibration, and recipe handover by senior process engineers.


Training: Hands-on instruction covering hardware maintenance, vacuum troubleshooting, and safety protocols.


Support: Remote diagnostic software integration for real-time PLC troubleshooting, backed by regional spare parts inventory.

 

FAQ

 

Q: How does the system control macroparticles (droplets)?

A: Standard systems use optimized magnetic confinement fields to steer arc spots rapidly. For optical or ultra-smooth applications, we integrate Filtered Cathodic Arc (FAC) magnetic ducts to filter out droplets entirely.

Q: What is the target utilization rate and replacement time?

A: Planar and circular targets achieve 45%-60% utilization. Targets are water-cooled and mounted via quick-clamp seals, allowing target replacement within 45 minutes.

Q: What are the facility utility requirements?

A: Chilled water supply (8–15 m³/h, 18–22°C, 0.2–0.3 MPa), compressed air (0.6 MPa), and stable 3-phase industrial power.

Q: Can existing process recipes be transferred?

A: Yes. The Siemens IPC platform allows direct parameter input for arc current, bias voltage, gas flow, and duration to match existing industrial recipes.

 

Hot Tags: cathodic arc thin film equipment, China cathodic arc thin film equipment manufacturers, suppliers, factory

Send Inquiry
Contact us if you have any question

You can either contact us via phone, email or online form below. Our specialist will contact you back shortly.

Contact now!