The IBAE system combines electron-beam or thermal evaporation with an integrated broad-beam ion source. Simultaneous ion bombardment during film growth transfers kinetic energy to condensing adatoms, eliminating columnar microstructures and producing near-bulk-density thin films with minimal moisture-induced spectral shift.
Technical Specifications
|
Parameter |
Specification |
|
Base Pressure |
<= 5.0 x 10^(-5) Pa (achieved within 35 minutes) |
|
Working Pressure |
1.0 x 10^(-1) to 1.0 x 10^(-2) Pa |
|
Ion Source Type |
Gridless End-Hall / Kaufmann Ion Source |
|
Ion Beam Energy |
50 eV to 1500 eV (closed-loop stabilized) |
|
Ion Beam Current Density |
0 to 2.5 mA/cm^2 |
|
Evaporation Sources |
Multi-pocket E-beam Gun (4 x 15 cc to 6 x 40 cc) / Resistance boats |
|
Substrate Holder |
Planetary rotation fixture with heating up to 300 deg C |
|
Thickness Uniformity |
<= plus/minus 0.5 percent over 400 mm diameter |
|
Control System |
Siemens S7-1500 PLC + Industrial PC (Inficon deposition controller) |
Key Features
Dual-Mode Bombardment: Kinetic energy transfer densifies films at low substrate temperatures, protecting delicate optics and polymer substrates.
Closed-Loop Ion Stabilization: Integrated mass flow controllers maintain constant ion flux throughout long production runs, ensuring batch consistency.
Modular Vacuum Chamber: 304L stainless steel structure with electro-polished interior (Ra <= 0.2 um) and Conflat metal seals.
Automated Sequencing: PLC-managed pump-down, deposition, and vent cycles minimize operational variance.
Vacuum System Configuration
Roughing Pumps: Oil-free dry roots and rotary vane pumps.
High Vacuum Pump: Magnetically levitated turbomolecular pump (1600 L/s).
Gauges: Combination Pirani, cold cathode, and Baratron capacitance manometers.
Valving: Pneumatic gate and angle valves with hardware safety interlocks.
Evaporation Materials & Substrate Compatibility
Oxides: SiO2, Ta2O5, TiO2, Nb2O5, Al2O3
Fluorides: MgF2, LaF3
Metals: Au, Ag, Al, Ti, Cr
Substrates: Fused silica, BK7, silicon wafers, germanium, zinc selenide (ZnSe), and heat-resistant polyimide.
Applications
Precision Optics: Narrowband pass filters and DWDM coatings requiring stable center wavelengths.
Laser Optics: High-damage-threshold reflectors and anti-reflection coatings.
Semiconductor & Photonics: Dielectric protective layers, passivation, and optical waveguides.
Solar Energy: Transparent conductive oxide (TCO) interface modification.
Customization
Chamber Sizing: Scalable diameters from 600 mm to 1200 mm.
Source Layout: Up to three e-beam guns and multiple thermal sources per platform.
In-Situ Metrology: Broadband optical monitoring (BOM) or quartz crystal microbalance (QCM) integration.
Automation: Robotic substrate loading interfaces compliant with SEMI standards.
Quality Control
Leak Detection: Helium mass spectrometer testing per chamber (sensitivity <= 1 x 10^(-10) Pa*m^3/s).
Component Sourcing: Tier-1 industrial brands (Inficon, MKS, Edwards, Siemens).
Factory Acceptance (FAT): 72-hour continuous dry run and verification coating measuring refractive index and uniformity prior to dispatch.
Installation & Technical Support
Documentation: Complete English package including electrical schematics, P&ID diagrams, and PLC source codes.
Field Services: Turnkey installation, vacuum calibration, and recipe tuning by application engineers.
Remote Diagnostics: Secure VPN module for software and process troubleshooting.
FAQ
Q: How does ion assistance alter oxide refractive index?
A: Energetic ion bombardment expels trapped residual gases and densifies the microstructure, shifting the refractive index of films like Ta2O5 and TiO2 closer to bulk values.
Q: What is the typical maintenance interval for the ion source?
A: Maintenance intervals range from 150 to 300 processing hours, depending on process gases and operating power density.
Q: Can this system manage reactive gas processes?
A: Yes. Independent mass flow controllers inject reactive gases (O2, N2) directly into the ion source and chamber zones, interlocked with safety pressure switches.
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