Equipment Description:
· Equipment introduction:
》 The process gas molecules passing through the etching chamber decompose and ionize to produce plasma.
》 Some of the active groups in the plasma react chemically with the surface of the etched material;
》Thin film etching equipment through the pulse/radio frequency power supply, the positive ions in the plasma are physically bombarded on the surface of the etched material, so as to clean, modify and etch the surface of the material by a combination of physics and chemistry.
· Equipment advantages:
》Ultra-low etching temperature, to meet the temperature requirements of different occasions, can avoid thermal stress and substrate deformation;
》Dual ion source can be lifted by both sides of the cylinder, easy maintenance;
》Thin film etching equipment adopts ion beam cleaning source and unique discharge technology, high plasma density, etching cleaning effect is good, with good uniformity;
》Alarm and protection: Comprehensive safety protection includes: temperature safety protection function, overload protection function, short circuit break alarm protection function, various misoperation protection function.
Application Field:
》Etchable materials: metal, non-metal, alloy, electronic components (monocrystalline silicon, amorphous silicon, polysilicon, SOI), metal oxides, nitrides, carbides, ceramics, polymers, superconducting materials, etc.
》It can be used as a film fading machine for DLC/ta-C films.
》Can be used in: 3C consumer electronics, electronic components, optics, transportation, tool mold, home appliances, new energy, medical, research institutes and other industries.
Before ion etching After ion etching
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