Plasma Cleaning Machine

Plasma Cleaning Machine is a versatile solution for removing organic contaminants, oxides, and microscopic residues from material surfaces. By leveraging low-temperature plasma technology, it significantly enhances surface energy and adhesion while avoiding thermal damage to sensitive substrates.

Non-Thermal Cleaning Process

• Operates at temperatures below 80°C, ideal for heat-sensitive materials such as polymers (PET, PC), rubber, and biopolymers.
• Surface activation: Increases surface energy from 30–40 mN/m to 60–70 mN/m, improving wettability for coatings, adhesives, or inks.

High-Efficiency Contaminant RemovalDual cleaning mechanisms:

• Chemical cleaning: Oxygen plasma oxidizes organic residues (oils, fingerprints) into volatile CO₂ and H₂O.
• Physical bombardment: Argon ions dislodge inorganic particles (dust, metal oxides).
• Cleaning speed: Achieves 99.9% purity within 2–5 minutes, depending on contaminant type.

Adaptable Configuration

• Multi-gas compatibility: Supports Ar, O₂, N₂, and mixed gases for tailored cleaning effects.
• Adjustable electrode spacing: The rotating platform can be raised or lowered (0–300 mm range) to optimize plasma density distribution.

User-Friendly Design

• Quick maintenance: The dual ion sources are mounted on pneumatic升降 mechanisms, allowing easy access for replacement or cleaning.
• Compact footprint: Customizable dimensions (width: 800–2000 mm) adapt to limited production spaces.

Pre- and Post-Cleaning Comparison

• Pre-Cleaning: Surfaces may contain grease, oxide layers, or release agents, leading to coating delamination or poor print quality.
• Post-Cleaning: A chemically active, ultra-clean surface is obtained, ensuring robust adhesion in applications like medical device assembly or automotive part bonding.

• Medical Devices: Sterilization and activation of surgical tool surfaces.
• Packaging: Improving ink adhesion on plastic films.
• Automotive: Pre-treatment of rubber seals before bonding.