Dry Etching Equipment is a high-performance solution for precision material processing across diverse industries. Utilizing advanced reactive ion etching (RIE) technology, this equipment achieves non-contact, residue-free etching without liquid chemicals, making it ideal for applications requiring micron-level accuracy and environmental compliance.
Technical Innovations:
Anisotropic Etching Capability
- The system combines chemical reactions (plasma-activated species) with directional ion bombardment, enabling precise vertical etching profiles. This is critical for creating microstructures on metals (e.g., stainless steel, titanium alloys), ceramics (Al₂O₃, SiC), and polymers (PEEK, PTFE).
- Etching uniformity is maintained within ±5% across substrates up to 800 mm in diameter, even for complex geometries.
Modular Design & Scalability
- Multiple ion source configurations: The equipment supports linear, circular, or radiofrequency-coupled ion sources, allowing simultaneous processing of multiple workpieces.
- Adjustable process parameters: Ion energy (50–500 eV) and plasma density (10¹⁰–10¹² cm⁻³) can be optimized to balance etching rate (up to 30 nm/min) and surface smoothness (Ra < 0.1 μm).
Eco-Friendly Operation
- Zero liquid waste: Unlike wet etching, the dry process eliminates hazardous chemical disposal.
- Energy-efficient design: The 10 kW power consumption is 30% lower than traditional systems, with heat dissipation managed via a closed-loop pure water cooling system (≥4 m³/h flow rate).
Enhanced Process Control
- Real-time monitoring: The integrated PC-based control system tracks vacuum levels (base pressure ≤5.0×10⁻⁴ Pa), gas flow rates, and ion beam stability.
- Automated safety protocols: Overload protection, arc suppression, and emergency shutdown mechanisms ensure operational safety.
Pre- and Post-Etching Performance
- Pre-Etching: Surfaces may exhibit oxidation layers, organic residues, or uneven textures, which compromise coating adhesion or functional performance.
- Post-Etching: A clean, defect-free surface with controlled roughness is achieved, enhancing subsequent processes such as PVD coating, bonding, or printing.
Applications:
- Optics: Etching anti-reflective microstructures on lenses and display panels.
- Precision Tools: Surface texturing of tools and molds to improve wear resistance.
- New energy Components: Structuring electrodes for battery and fuel cell systems.
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