Magnetron Sputtering Coating Machine

Magnetron sputtering coating machine is a plasma sputtering technology controlled by magnetic field. The working principle of the magnetron sputtering coating machine is to use the magnetic field to control the charged particles in the plasma, so that it produces high density plasma on the surface of the target, so as to achieve an efficient sputtering process. The magnetron sputtering coating machine mainly includes vacuum chamber, target material, substrate, magnetic field system, gas supply system and power supply system. In the sputtering process, the vacuum chamber is first pumped to a high vacuum state, and then an inert gas (such as argon) is injected. Under the action of an electric field, argon gas is ionized into argon ions and electrons. Argon ion bombards the surface of the target under the acceleration of electric field, which makes the target atoms or molecules sputtered out. At the same time, the electrons are bound near the surface of the target under the action of the magnetic field, forming a high-density plasma, which increases the sputtering rate. The sputtered target atoms or molecules are deposited on the substrate to form a film. Magnetron sputtering coating machine can be widely used in microelectronics, optoelectronics, nanotechnology, new materials and other fields, providing an efficient and environmentally friendly film preparation method for modern industry and scientific research.

Magnetron sputtering coating machine has a unique core technology, with the following advantages:

1. Fast deposition rate. The magnetron sputtering coating machine can obtain a large ion flow due to the use of high speed magnetron electrode, which effectively improves the deposition rate and sputtering rate during the coating process.

2, high power efficiency. The magnetron sputtering machine generally selects the appropriate voltage to ensure that the equipment is just within the highest effective range of power efficiency.

3. Low sputtering energy. Applying low voltage can prevent higher energy charged particles from incident on the substrate and avoid deformation of the product substrate.

4. Composite target material. Modular universal interface, directly compatible with different forms of cathode targets, allowing DC pulse, IF, RF working mode; Strong compatibility;

Wide range of applications. There are many elements that can be deposited by magnetron sputtering coating machine, the common ones are: Cu, Au, Cr, Ni, Ta, TiN, TiC, TiCN, TiAlN, CrN and other metal, non-metal and ceramic oxide films and composite films;