PVD Hybrid Thin Film Deposition System

The PVD Hybrid Thin Film Deposition System integrates thermal evaporation, electron beam (e-beam) evaporation, and RF/DC magnetron sputtering within a single vacuum architecture. This platform enables sequential or co-deposition of metals, alloys, and dielectrics without breaking vacuum, preventing interfacial oxidation. Engineered for R&D institutions and pilot production lines, the system handles substrates up to 6 inches with automated multi-axis rotation.

Modular Sockets: Interchangeable source flanges allow rapid reconfiguration between sputtering cathodes and thermal/e-beam evaporators.

Isolation Architecture: Pneumatic gate valves isolate the process chamber from the high-vacuum stack to minimize particle generation.

In-Situ Monitoring: Dedicated ports for quartz crystal microbalance (QCM) sensors and optical emission spectroscopy (OES).

Interlocked Safety PLC: Hardware interlocks prevent source activation during high pressure, cooling water failure, or safety breaches.

Roughing Pump: Dry scroll pump (30 m^3/h) to eliminate hydrocarbon backstreaming.

High Vacuum Pump: Magnetically levitated turbomolecular pump (1200 L/s for N2) backed by a cryogenic trap.

Gauges: Combined Pirani and Cold Cathode sensors spanning atmosphere to 10^-7 Pa.

Bakeout: Cartridge heater jackets with external insulation blankets reaching up to 150 deg C.

Evaporation Materials:
Metals: Au, Ag, Al, Ti, Cr, Pt, Cu, Ni

Dielectrics & Oxides: SiO2, TiO2, Al2O3, ITO

Semiconductors: Si, Ge

Substrate Types: Single-crystal silicon wafers, glass, quartz, polyimide films, and metal foils.

Optoelectronic Devices: Transparent conductive electrodes (ITO) and multi-layer reflectors for OLEDs and solar cells.

Microelectronic Packaging: Under-bump metallization (UBM) and seed layers for wafer-level packaging.

Advanced R&D: Quantum device structures, superconductor thin films, and magnetic tunnel junctions (MTJ).

Chamber Scale: Extended dimensions for 12-inch substrates or glovebox integration.

Source Setup: Custom crucible volumes, RF bias power supplies, and ion-assisted deposition (IAD) modules.

Automation: Touchscreen recipe management or full SECS/GEM factory automation compliance.

Leak Testing: Helium mass spectrometer testing per chamber (< 1 x 10^-10 Pa*m^3/s threshold).

Dimensional Checks: CMM verification of source-to-substrate distances and flange tolerances.

Electrical Testing: Hi-Pot testing, grounding continuity checks, and EHS audits on all high-voltage lines.

Factory Acceptance Testing (FAT): Pre-shipment checks for base pressure, source functionality, and automated cycling at our facility.

Field Installation: On-site mechanical alignment, utility hookup verification, and Site Acceptance Testing (SAT).

Documentation: Complete delivery includes electrical schematics, P&ID diagrams, PLC backups, and mill test certificates.