Equipment Description:
· Equipment introduction:
Plasma enhanced thin film equipment is a pure ion coating technology (pure ion beam), high-energy ion beam cleaning technology (Ionbeam),Magnetron Sputter technology (Sputter) and Magnetic confinement vapor deposition (Magnetic confinement-CVD) are four technologies in one, which is a perfect fusion of PVD technology and CVD technology.
Plasma enhanced thin film equipment provides a more flexible process combination to meet a variety of complex product needs, and its powerful hybrid process provides more possibilities for process designers.
Plasma enhanced thin film equipment brief introduction of equipment functions:
(1) Pure ion coating source, using efficient electromagnetic filtration system, effectively remove particles, obtain higher purity ion beam, help improve the coating hardness and binding force;
(2) High energy ion beam cleaning source, using a specially designed discharge structure, effectively compatible with plasma cleaning activation, auxiliary ionization, independent deposition and other functions;
(3) Magnetron sputtering source, using innovative magnetic field design, effectively improve the target utilization rate of more than 30%;
(4) Magnetically confined vapor deposition source, reliable and easy to maintain structure, can achieve fast and fine coating deposition.
Typical coating types:
(1) Me-TAC, metal TAC composite coating, widely used
(2) Me-DLC, metal DLC composite coating, widely used
(3) Me-TAC-DLC, TAC-DLC composite coatings, while obtaining higher basic hardness and binding force of TAC, have the deposition rate and fine appearance of DLC.
· Equipment advantages:
》Plasma enhanced thin film equipment can realize the combination of TAC-DLC, which greatly improves the binding force compared with the simple CVD, while reducing the particle size of PVD and shortening the process time.
》Plasma enhanced thin film equipment can achieve a variety of processes C film deposition, pure ion plating TAC, magnetic confinement discharge DLC, anode layer ion source plating DLC, etc.
》Plasma enhanced thin film equipment is equipped with an electromagnetic scanning device and software, which can control the beam direction of the plasma at a fixed point and time, greatly improving the problem of coating uniformity, and the uniformity of the entire furnace film layer is controlled below ±5%;》Optimized magnetic field design and cooling design, easy maintenance, good equipment stability;
》Friendly man-machine interface, real-time recording of process data, conducive to quality control, difficult analysis, development of new processes;
》This project is a turnkey equipment, Pure Source company provides a complete solution, including stable mature coating formula.
Application Field:
》Universities and research institutes, industrial consumables manufacturing, consumer electronics industry, etc.;
》Key engine components for automobiles and diesel vehicles;
》Key parts of the textile industry;
》High-end cutting tools and medical equipment industry;
Coating Type:
|
Coating type |
Depositiontemperature range |
Microhardness(HV) |
Coating binding power(N) |
Maximum service temperature(°C) |
Thickness(μm) |
|
Super-hard ta-C |
<150℃ |
4000-5500 |
≥35N |
600°C (under N2 protection) |
1-2 |
|
Normal ta-C |
<150℃ |
2000-4500 |
≥35N |
350°C |
2-4 |
|
Thick ta-C |
<150℃ |
1800-2200 |
≥35N |
350°C |
5.5-8 |
|
Ultra-Thick ta-C |
<150℃ |
1800-2200 |
≥35N |
350°C |
20-28 |
|
DLC |
<120℃ |
1700-2500 |
≥30N |
250°C |
2-20 |
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